JPH0346504Y2 - - Google Patents
Info
- Publication number
- JPH0346504Y2 JPH0346504Y2 JP1985108643U JP10864385U JPH0346504Y2 JP H0346504 Y2 JPH0346504 Y2 JP H0346504Y2 JP 1985108643 U JP1985108643 U JP 1985108643U JP 10864385 U JP10864385 U JP 10864385U JP H0346504 Y2 JPH0346504 Y2 JP H0346504Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- wire bonding
- semiconductor chips
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985108643U JPH0346504Y2 (en]) | 1985-07-16 | 1985-07-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985108643U JPH0346504Y2 (en]) | 1985-07-16 | 1985-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6217182U JPS6217182U (en]) | 1987-02-02 |
JPH0346504Y2 true JPH0346504Y2 (en]) | 1991-10-01 |
Family
ID=30986026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985108643U Expired JPH0346504Y2 (en]) | 1985-07-16 | 1985-07-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0346504Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5211551U (en]) * | 1975-07-15 | 1977-01-26 | ||
JPS5696641U (en]) * | 1979-12-22 | 1981-07-31 |
-
1985
- 1985-07-16 JP JP1985108643U patent/JPH0346504Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6217182U (en]) | 1987-02-02 |
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